Encapsulation and Overmolding

Encapsulation and Overmolding

Encapsulation and overmolding with Rimnetics utilizes the low exothermic heat and process pressure produced by the RIM process to encapsulate even the most sensitive circuit boards, antennas and batteries while the low viscosity of the material ensures that even the most detailed geometries are filled out. Furthermore, Rimnetics provides reliable, structural ‘one-piece’ solutions wherever added functionality is needed or where sensitive equipment needs protection from the environment. Components to be encapsulated are fully or partially surrounded by the molded part which provides for the structural and cosmetic properties of the finished unit.

Examples of Encapsulation with RIM
Circuit Boards – will not melt PCBs
Batteries – will maintain battery's capacity
Antennas – will maintain or improve radio signal
Magnets – embed or hide magnets in the molded part
Glass – directly molded structural frames with added functions
Metal Rods, Bolts & Clips – anchored right into the part
Threaded Inserts – for attachments of assembly parts