Product Overview
Encapsulation
Plastic encapsulation of IC components is a process where an integrated circuits chip is being capsulated with Epoxy Molding Compound (EMC) via the transfer molding process to prevent physical damage or corrosion. In addition to the complex chemorheology of EMC, the electronic components with sophisticated and fine design have brought the challenges and uncertainty to encapsulation processes. Common defects of chip encapsulation include incomplete fill, voids, wire sweep, paddle shift and package warpage.
Moldex3D Encapsulation software provides comprehensive 3D solutions that help engineers to analyze the complicated physical phenomena inherent in encapsulation processes and further optimize the design and process
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