Underfill

Product Overview

Moldex3D Underfill software can simulate the capillary flow, which is influenced by the surface tension of encapsulant and the contact angle among encapsulant, bumps and substrate of dispensing process for flip chip underfill. Moldex3D Underfill allows users to input real dispensing procedure and predict the locations of voids in underfill process, to highly increase productivity.

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