Analytical Services and Techniques

Analytical Services and Techniques

DFWerke offers a comprehensive range of analytical services and techniques to assist companies in understanding the properties and behaviors of their materials at an atomic level. The company's product offerings focus on thermal analysis and material characterization, utilizing advanced technology and equipment. Here is a list of DFWerke's services and techniques:

1. Differential Scanning Calorimetry (DSC): Allows for the determination of polymer crystallinity, detection of glass transition in polymers, and analysis of processing-induced strain in polymers.

2. Thermal Gravimetric Analysis (TGA): Used for analyzing polymer decompositions, assessing polymer thermal stability, evaluating silica fill levels in polymer composites, characterizing EPDM rubber, estimating polymer lifetime through decomposition kinetics, and differentiating between grades of ABS by high-resolution TGA.

3. Dielectric Analysis (DEA): A technique that can be employed in characterizing resin curing processes.

4. Dynamic Mechanical Analysis (DMA): Useful for characterizing cured rubber, measuring the structure of low viscosity fluids, characterizing heat shrink films, and analyzing printed circuit board materials among others.

5. Rheometry: Applies to measuring the structure of low viscosity fluids in oscillation and characterizing resin curing by controlled stress rheology.

6. Solomat TSC/RMA 9100 (TSC) Spectrometer: A specialized instrument for advanced material characterization, enhancing the capabilities of the above analyses.

Specific applications of these techniques include:
- Determination of Polymer Crystallinity by DSC.
- Detection of Glass Transition in Polymers by DSC & DMA.
- Modulated DSC Evaluation of Isothermal Cure and Vitrification for Thermosetting Systems.
- Detection of Processing Induced Strain in Polymers by DSC.
- Polymer Thermal Stability by TGA.
- Characterization of EPDM Rubber by TGA.
- Estimation of Polymer Lifetime by TGA Decomposition Kinetics.
- Differentiation Between Grades of ABS by Hi-Res TGA.
- Characterization of Heat Shrink Films Using DMA Film Clamps and Controlled Force Mode.
- Characterization of Printed Circuit Board Materials by DMA.
- Measuring Structure of Low Viscosity Fluids in Oscillation Using Rheometers.

DFWerke caters to companies requiring in-depth analysis of their materials, offering both routine thermal analysis and comprehensive consulting to address material challenges and opportunities.